Kenyan students among world’s young innovators competing for $4 million in prizes

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Four Kenyan students have left for Pittsburg Pennsylvania, USA to attend International Science and Engineering Fair, world’s largest international pre-college science competition a program of society for science and the public.

The convention brings together about 1,700 high school students from over 75 countries, regions and territories to showcase their independent research and compete for $4 million in prizes. The four youngsters, from SCLP Samaj School in Nairobi will join other young innovators selected from 422 affiliate fairs to showcase cuttingedge inventions.

Millions of students worldwide compete each year in local and school-sponsored science fairs; the winners of these events go on to participate in SSP-affiliated regional and state fairs from which the best win the opportunity to attend Intel ISEF.

Siddieeq Parpia and Jamaldin Mohammed both aged 15, will present a project “Bio-hydrometallurgy” under the Environmental Engineering category. The project involves extraction of iron from iron pyrite (a low grade ore of iron) using naturally occurring and living microorganisms such as bacteria. Siddieeq and Jamal are seeking to provide an alternative solution to the current mining technologies such as using explosives, cyanide and other chemicals that are harmful to the environment.

The two believe the green solution to mining is a critical innovation for the country and world at large.

Their peers Bulari Varsani and Jaspreet Matharu, also aged 15, will on the other hand be showcasing a medical project “Cationic Peptides” that the two believe is  a sure solution to the spread of HIV/AIDS.  Bulari and Jaspreet are exploring   the use of production to stop the replication of the HIV virus.

Also, the Intel International Science and Engineering Fair provides brilliant teenagers with a unique opportunity to share cutting-edge ideas, exchange cultural perspectives and build lifelong friendships.

SSP partners with Intel—along with dozens of other corporate, academic, government and science-focused sponsors—who provide the support and awards for Intel ISEF. The Fair is hosted each year in a different city (Los Angeles, Pittsburgh and Phoenix through 2019).  The Local Arrangements Committees from each city partner with SSP and Intel to provide support for the event including the recruitment of 100s of volunteers and judges and in organizing an education outreach day in which more than 3,000 middle and high school students’ visit.

 

 

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TECHNOLOGY

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